|Priority Packaging, Inc. provides integrated circuit expertise in|
|Die Recovery||Die repackaging||
FA / Qualification / Evaluation Die Repackaging
|IC packaging||IC repackaging||IC Prototyping|
|IC bonding||BGA reball / rework||Open-cavity Assembly|
|IC Assembly||Module Assembly||MCM Hybrid (Laminate-Ceramic) Assembly|
|Flip-chip Assembly||Stacked-Die Assembly||Scanning Acoustic Microscopy (SAM C-SAM)|
|Failure Analysis||Cross-sectioning||X-ray (High Magnification / Resolution)|
|Chemical deprocessing||Decapsulation||Laser Etch, marking, ablating|
|Reliability testing||Preconditioning||Temperature cycling|
|Thermal shock||Autoclave||High-temp (temperature) storage life.|
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Priority Packaging, Inc. offers a unique opportunity to customers by merging Failure Analysis, IC Assembly and Reliability knowledge into one service offering. The combined impact of expertise in these complimentary disciplines results in the quickest and most efficient high quality solution for our customers. We invite you to visit our facility or contact one of our representatives.