Services
- Package Assembly and Failure Analysis support related services
- Prototype IC Packaging, Stacked-die packaging, Hybrid MCM module packaging (Laminate/Ceramic)
- Repackaging of chip scale, stacked-die, bare die, flip chips, obsolete die, etc. for FA / Qualification / Engineering Evaluation requirements.
- FA, Reject and Qualification Die recovery
- Laser etching, ablating and marking
- Cross-sectioning (X-Sectioning)