Semiconductor Packaging, Reliability & Failure Analysis Services
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SERVICES

IC Prototype Packaging

IC Repackaging

BGA Reball/Rework

Reliability Testing


IC Prototype Packaging

Priority Packaging, Inc. offers quick turn prototype assembly services. We will provide your team Quality workmanship, fast turn around times, and focused attention towards the specifics of your application. This commitment to thoroughly serve customer needs has distinguished us from the competition.

Priority Packaging will also provide step-by-step imaging of applied materials and process results so that you can monitor die, package and device feature conditions as they are exposed to assembly steps and environmental excursions.