IC Repackaging
Priority Packaging, Inc. offers a unique "repackaging" capability. The service enables our customers to repackage "flip chips", bare die, chip scale, "obsolete die", etc. into package solutions that suit their needs.
The Process
Using a combination of bonding, mechanical, and chemical process techniques, Priority Packaging, Inc. is able to provide customers with a superior level of service for a wide variety of packaging solutions.
A Flip-Chip Device is shown